ASM Placement Machine Maintenance Precautions
2026-06-10
ASM placement machine repair must strictly adhere to the principles of safety, anti-static, standardized diagnostics, and use of original manufacturer spare parts. Blind disassembly or operation while the machine is powered on is strictly prohibited.
Power off and lock/disconnect (LOTO): Before repair, the main power and gas supply must be disconnected, and capacitors must be fully discharged to prevent electric shock or accidental mechanical start-up.
Full-time anti-static protection: Wear anti-static wrist straps and anti-static clothing, and use a grounded anti-static mat, especially when handling electrostatic-sensitive components such as the motherboard, encoder, and vision system.
Accurate fault diagnosis is paramount: First, read the equipment alarm codes (such as CSB, SMPS-09 errors), observe the logs, and use the "phenomenon-module-signal chain" logic for troubleshooting to avoid aimless replacement of boards or nozzles.
Use original manufacturer or certified compatible spare parts: If replacing critical components such as feeders, pick-and-place heads, encoders, and power modules (such as SMPS-09), they must be compatible with electrical and mechanical specifications; otherwise, calibration failure or cascading damage may occur.
**Strictly prohibit hot-plugging cables and boards:** For components involving X/Y axis drives, vision interfaces, and I/O boards, power must be disconnected before disassembly and assembly in sequence. Cable positions should be marked to prevent incorrect insertion.
**Post-repair calibration and verification are mandatory:** Any repair involving the placement head, optical system, or mechanical axes must undergo nozzle height learning, coaxiality correction, mapping accuracy compensation, and CPK testing. Do not proceed directly to production.
**Environment and record control:** Repairs must be performed in a clean, dry (humidity
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Features of ASM V Series Placement Machines
2026-06-01
The SIPLACE V series, launched by ASMPT (formerly Siemens' SMT division), is a next-generation pick-and-place machine platform designed for high-end intelligent manufacturing and large-scale, high-density production. This series is specifically designed for AI integration, massive data processing, and extremely high production efficiency. Its performance indicators and specifications are as follows:
Core Performance and Specifications
Rated Capacity: Up to 105,000 CPH (placement points per hour).
Standard Accuracy: ±25µm @3sigma.
PCB Size: Supports up to 850 mm x 610 mm.
Feeder Capacity: Up to 90 8 mm tape feeders.
Legacy: 1.1m x 2.4m x 1.6m.
Key Technical Highlights
Innovative Real Performance: Utilizing a new mechanical architecture, ultra-efficient linear drives, and a high-resolution measurement system, it increases real performance by up to 30% compared to previous models in key industries such as automotive electronics, smartphones, and AI computing servers.
Highly Flexible Placement Head Technology: Supports hot-swappable placement heads during runtime. Includes:
CP20: High-speed pick-and-place head (up to 52,500 cph).
CPP: Multi-functional all-round head (can be switched between pick-and-place, pick-and-place, and mixed modes via software).
TWIN VHF: Large/heavy-duty component expert (placement pressure up to 100N, supports components up to 200 x 150 x 28mm).
High Hardware and Software Compatibility: Perfectly compatible with existing SIPLACE system hardware (such as cameras and feeders) and the WORKS Software Suite software ecosystem, enabling smooth production line upgrades.
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ASM CPP placement head
2026-05-29
The ASM CPP (MultiStar CPP) is the core multi-functional placement head of the ASM (formerly Siemens) SIPLACE series pick-and-place machines. It supports mixed C&P (Collect & Place) and P&P (Pick & Place) modes, and is suitable for components from 01005 to 50×40×11.5mm. It features a 12-segment star layout, independent vacuum and DP drive, and a placement accuracy of ±25µm@3σ.
Full Name and Positioning: CPP = Collect & Place / Pick & Place, a multi-functional placement head (not a pure high-speed head), commonly used in SIPLACE TX2i, SX2, and other models; CP20 is the pure high-speed head (20 nozzles).
Component Coverage: 01005 (0.4×0.2mm) to large-size components (≤50×40mm, height ≤11.5mm), supporting irregularly shaped components (requires P&P mode).
Structural Features: 12 independent positioners (star-shaped arrangement), each with an independent vacuum generator, DP rotary motor, and integrated downward-facing camera, enabling high-speed, pre-alignment-free placement.
Typical Applications: High-mix, small-batch PCBs (e.g., automotive electronics, industrial control boards), accommodating both high-speed placement of micro-components and high-precision placement of medium to large-sized components.
Important Notes: CPP ≠ CP20 (the latter is a pure high-speed head with no P&P capability); also not "TwinStar" (used for oversized irregularly shaped components).
Accessories Reference: Common models such as CPP, CPPM, MultiStar CPP; nozzles/adapters (e.g., 03011583) must be compatible with specific models (TX/SX/V series).
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SMT NOZZLES
2026-02-28
1. Vacuum Pick-up (Component Extraction)
This is the primary function of the nozzle. By utilizing negative pressure (vacuum) generated by the SMT machine, the nozzle picks up electronic components from the feeder station.
2. Stable High-Speed Transportation
Modern pick-and-place machines move at incredible speeds with high G-force acceleration. The nozzle must firmly hold the component during these rapid lateral and rotational movements.
3. Vision Alignment Support
Most SMT machines use CCD cameras to "see" the component while it is on the nozzle. The nozzle’s background color (typically matte black or green) provides high contrast against the shiny metallic leads of the component.
4. Precise Component Release
Once the nozzle reaches the target coordinate on the PCB, the vacuum is instantly cut off, often followed by a micro-burst of positive air pressure.
5. Component and PCB Protection
Nozzles are engineered with a delicate spring-buffer mechanism.
Selection Tips:
Material Science:
Tungsten Steel: Durable and strong, but prone to magnetization.
Ceramic: Never turns white and is non-magnetic—the gold standard for high-precision 0201 or 01005 components.
Diamond-Like Carbon (DLC) Coating: Extreme hardness for massive production runs to prevent tip wear.
ESD (Electrostatic Discharge) Safety: High-quality nozzles must be anti-static to prevent accidental electrical discharge from frying sensitive semiconductor components during the pick-and-place process.
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